IPC-TM-650 Test Methods
Industry-standard test methods per IPC-TM-650: thermal stress, solderability, ionic contamination, microsection, peel strength, impedance.
Industry-standard test methods per IPC-TM-650: thermal stress, solderability, ionic contamination, microsection, peel strength, impedance.
ROSE testing per IPC-TM-650 2.3.25 measures residual ionic contamination. Ensures long-term reliability against corrosion and electrochemical migration.
PCBA cleaning machine. Removes post-solder flux residue & ionic contamination. Essential for high-impedance circuits where leakage currents cause field failures. Aerospace, medical & military-grade reliability.
Tour Superb Automation's QC laboratory — a 10-station inspection pipeline covering 3D AOI, X-ray CT, Flying Probe ICT, FCT, thermal stress, ionic contamination, and visual final inspection. Every board passes through this lab before shipment.
Ionic contamination testing per IPC-TM-650 measures residual flux and ionic contamination on PCBA surfaces. Prevents dendritic growth and leakage currents. Essential for high-impedance and high-reliability circuits.